store last time buy inventory

5 Jul 2018 No Comments

EDX Introduces Industry-Leading Die and Wafer Banking Solution

EDX Electronics has officially announced new die and wafer banking capabilities for their customers around the world. While banking raw wafer and die has become a valuable option for OEMs […]
3 Jul 2018 No Comments

EDX Electronics Completes Construction of Custom Storage Vault

After an extensive planning and construction process, EDX Electronics is officially declaring its custom storage vault completed and ready for business. As the latest addition to EDX’s last time buy […]
8 May 2018 2 Comments

Die and Wafer Banking Costs: Prohibitive or Accessible?

In addition to added IP protection and ASIC performance efficiency, one of the greatest strengths of die and wafer banking is long-term cost-effectiveness. At the current rate of innovation and […]
7 Mar 2018 No Comments

Choosing a Die and Wafer Banking Partner? Pay Attention to Recovery Times

As the use of ASICs in product designs continues to grow – and die and wafer banking becomes more prominent in OEM obsolescence management strategies – it is important for […]
27 Feb 2018 No Comments

Addressing Two Primary Concerns Associated with Die and Wafer Banking

When making the decision to implement ASICs into their product designs, original equipment manufacturers (OEMs) often look at the benefits ASICs can offer their supply chain. Tighter obsolescence management procedures, […]
15 Feb 2018 5 Comments

The Challenge of Die and Wafer Banking: Solved

As technology in the electronics industry continues to evolve and accelerate at an unprecedented rate, manufacturers are being forced to adapt their tried-and-true supply chain models to confront this new […]