EDX Electronics has officially announced new die and wafer banking capabilities for their customers around the world. While banking raw wafer and die has become a valuable option for OEMs […]
Our Critical Inventory Storage Solutions here at EDX take many forms. All inventory is different, as are the specifications of each individual client, and as a result, no two customized […]
In addition to added IP protection and ASIC performance efficiency, one of the greatest strengths of die and wafer banking is long-term cost-effectiveness. At the current rate of innovation and […]
As the use of ASICs in product designs continues to grow – and die and wafer banking becomes more prominent in OEM obsolescence management strategies – it is important for […]
When making the decision to implement ASICs into their product designs, original equipment manufacturers (OEMs) often look at the benefits ASICs can offer their supply chain. Tighter obsolescence management procedures, […]
As technology in the electronics industry continues to evolve and accelerate at an unprecedented rate, manufacturers are being forced to adapt their tried-and-true supply chain models to confront this new […]
