maintain business continuity

5 Jul 2018 No Comments

EDX Introduces Industry-Leading Die and Wafer Banking Solution

EDX Electronics has officially announced new die and wafer banking capabilities for their customers around the world. While banking raw wafer and die has become a valuable option for OEMs […]
21 Jun 2018 No Comments

Common Questions about Die and Wafer Banking at EDX

Our Critical Inventory Storage Solutions here at EDX take many forms. All inventory is different, as are the specifications of each individual client, and as a result, no two customized […]
8 May 2018 2 Comments

Die and Wafer Banking Costs: Prohibitive or Accessible?

In addition to added IP protection and ASIC performance efficiency, one of the greatest strengths of die and wafer banking is long-term cost-effectiveness. At the current rate of innovation and […]
6 Mar 2018 4 Comments

Does Your Obsolescence Management Strategy Require a Vault?

One doesn’t have to try hard to recall the earthquake and tsunami disaster that befell the coast of Tohoku on March 11th, 2011. In addition to the 15,894 confirmed people […]
27 Feb 2018 No Comments

Addressing Two Primary Concerns Associated with Die and Wafer Banking

When making the decision to implement ASICs into their product designs, original equipment manufacturers (OEMs) often look at the benefits ASICs can offer their supply chain. Tighter obsolescence management procedures, […]
15 Feb 2018 5 Comments

The Challenge of Die and Wafer Banking: Solved

As technology in the electronics industry continues to evolve and accelerate at an unprecedented rate, manufacturers are being forced to adapt their tried-and-true supply chain models to confront this new […]