Die Banking

5 Jul 2018 No Comments

EDX Introduces Industry-Leading Die and Wafer Banking Solution

EDX Electronics has officially announced new die and wafer banking capabilities for their customers around the world. While banking raw wafer and die has become a valuable option for OEMs […]
21 Jun 2018 No Comments

Common Questions about Die and Wafer Banking at EDX

Our Critical Inventory Storage Solutions here at EDX take many forms. All inventory is different, as are the specifications of each individual client, and as a result, no two customized […]
8 May 2018 2 Comments

Die and Wafer Banking Costs: Prohibitive or Accessible?

In addition to added IP protection and ASIC performance efficiency, one of the greatest strengths of die and wafer banking is long-term cost-effectiveness. At the current rate of innovation and […]
12 Apr 2018 No Comments

The Price OEMs Pay for IP Protection

The creation, marketing, and ultimately selling of a successful OEM product typically comes down to three simple factors: • Value: How much value does the product offer the consumer for […]
7 Mar 2018 No Comments

Choosing a Die and Wafer Banking Partner? Pay Attention to Recovery Times

As the use of ASICs in product designs continues to grow – and die and wafer banking becomes more prominent in OEM obsolescence management strategies – it is important for […]
6 Mar 2018 4 Comments

Does Your Obsolescence Management Strategy Require a Vault?

One doesn’t have to try hard to recall the earthquake and tsunami disaster that befell the coast of Tohoku on March 11th, 2011. In addition to the 15,894 confirmed people […]