A team in the US has developed a (relatively) simple way to execute 2D lithography in semiconductor manufacturing that stands to usher in a new era of electronics.
What they are doing is using nano-meter thick MoSe2 crystal semiconductors and coating them with a protective silicon layer. The silicon layer provides the design for the semiconductor, so that when they bombard it with the chemical sulfur it will be able to make contact with the MoSe2 and cause the selenium to be replaced. They use lasers to create a pulsing sulfur beam that has the ability to apply varied densities of the semiconductor, effectively creating variable properties and enabling the production of more complex electronics. This pulsed laser deposition allows for what is called “tuning of the bandgap”, where bandgap determines both electronic and optical capabilities.
Production in this manner allows manufacturers to create thinner, lighter and more versatile electronics for the growing industries such as wearables and smart devices.
To learn more about this new method of mono-layer semiconductor manufacturing, click here –